LP5300

Chip physical measurement report, including

1. The process technology,
2. Die size
3. The number of poly and metal layer
4. High-resolution chip imaging region drawn on low resolution die photo

With high resolution chip imaging packed in BrigenOne, you can determinate the region to be analyzed the schematics inside

• If you decide to perform a circuit analysis, we will provide a complete delivery, including BrigenOne, EDIF format schematics, and PDF file
• Imaging area will be included in the deliverables, and the work scope of circuit analysis is open to discussing.
• The information we provide about this project will be quite accurate because we have completed high-resolution wafer images of each layer.
• The quotation for this project DOES NOT include high-resolution chip images packaged in BrigenOne. Please contact us to get a quote
• If you decide to perform a circuit analysis with a price exceeding US$10,000, we will provide a 25% discount on the cost of chip imaging; for circuit analysis above US$20,000, we will discount 50% of the cost of chip imaging.